Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

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Authors: Fahimeh Emadi; Vesa Vuorinen; Mervi Paulasto-Krockel

Journal title: Electronics System-Integration Technology Conference (ESTC)

Journal number: 1

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/estc55720.2022.9939539