UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips

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Authors: Joshua Lommes, Gesa Patzelt, Volkmar Stenzel,

Journal title: Microelectronics Engineering

Journal publisher: Elsevier BV

Published year: 2023

DOI identifier: 10.1016/j.mee.2023.112014

ISSN: 0167-9317