Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

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Authors: F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen and M. Paulasto-Kröckel

Journal title: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/asdam55965.2022.9966765