Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

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Authors: A. Chvála, J. Marek, A. Šatka and J. Chen

Journal title: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/asdam55965.2022.9966769