SAC305 solder fatigue crack propagation under 3-point bending cycle test condition

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Authors: M. Zhang, J. Heilmann, Y. Sing Chan, M. Richard Niessner, P. Altieri-Weimar and B. Wunderle

Journal title: IEEE 9th Electronics System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2022

DOI identifier: 10.1109/estc55720.2022.9939510