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Authors: S. Fernbach, E. Kraker and N. Bedoya-MartÃnez
Journal title: nternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2023
DOI identifier: 10.1109/eurosime56861.2023.10100760
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