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Authors: M. Weninger, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst
Journal title: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2023
DOI identifier: 10.1109/eurosime56861.2023.10100800
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