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Authors: Andrada I. Velea, Joshua Wilson, Anna Pak, Manuel Seckel, Sven Schmidt, Stefan Kosmider, Nasim Bakhshaee, Wouter A. Serdijn, Vasiliki Giagka
Journal title: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.23919/empc53418.2021.9584962
ISBN: 978-0-9568086-7-7