EUV Mask Defect Inspection for the 3nm Technology Node

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Yannick Hermans, Tilmann Heil, Maksym Kompaniiets, Daniel Boecker, Bartholomaeus Szafranek, Daniel Rhinow, Gerson Mette, Christian Felix Hermanns, Renzo Capelli, Thomas Marschner, Patrick Salg, Luc Halipre, Darko Trivkovic, Sandip Halder

Journal title: Abstract submitted to EMLC Conference 2023

Journal publisher: SPIE

Published year: 2023