Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnection

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: A. Vandooren et al.

Journal title: VLSI Symposium

Journal number: June 2022

Journal publisher: VLSI

Published year: 2022

DOI identifier: 10.1109/vlsitechnologyandcir46769.2022.9830400

Search
Search on Google
Search on Bing
Search on DuckDuckGo
Contacts
Not specified (see website if available) or see associated project
Associated projects
Associated products/services
  • No items published
Organisations
  • Not specified
Powered by Chris Decubber BV