Impact of design of small volume Cu3Sn microbumps on its electromigration reliability for 3D ICs

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Authors: N. Tiwary, G. Ross, V. Vuorinen, M. Paulasto-Kröckel

Journal title: IEEE Transactions on Electronic Devices

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2022

ISSN: 0018-9383