A Novel Multi-Scale Method for Thermo-Mechanical Simulation of Power Integrated Circuit

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: A. Bojita, M. Purcar, D. Simon, C. Florea, C. Boianceanu and V. Topa

Journal title: IEEE Journal of the Electron Devices Society

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2022

DOI identifier: 10.1109/jeds.2022.3144530

ISSN: 2168-6734