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Authors: Giovanna Grosso, Thomas Moldaschl, Rene Fuger, Alfred Binder
Journal title: 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal number: 23-23 September 2021
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.1109/therminic52472.2021.9626505
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