On Optimising Spatial Sampling Plans for Wafer Profile Reconstruction

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Authors: S. McLoone, F. Zocco, M. Maggipinto, G.A. Susto

Journal title: 3rd IFAC Conference on Embedded Systems, Computational Intelligence and Telematics in Control

Journal publisher: IEEE

Published year: 2018

Electronics and ICT as enabler for digital industry and optimized supply chain management covering the entire product lifecycle
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