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Authors: M. Czernohorsky, K. Seidel, K. Kühnel, J. Niess, N. Sacher, W. Kegel, W. Lerch
Journal title: Microelectronic Engineering
Journal number: 178
Journal publisher: Elsevier BV
Published year: 2017
Published pages: 262-265
DOI identifier: 10.1016/j.mee.2017.05.041
ISSN: 0167-9317