Smart solutions for efficient dual strain integration for future FDSOI generations

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Authors: A. Bonnevialle, C. Le Royer, Y. Morand, S. Reboh, C. Plantier, N. Rambal, J.-P. Pedini, S. Kerdiles, P. Besson, J.-M. Hartmann, D. Marseilhan, B. Mathieu, R. Berthelon, M. Casse, F. Andrieu, D. Rouchon, O. Weber, F. Boeuf, M. Haond, A. Claverie, M. Vinet

Journal title: 2016 IEEE Symposium on VLSI Technology

Journal publisher: IEEE

Published year: 2016

Published pages: 1-2

DOI identifier: 10.1109/VLSIT.2016.7573406

ISBN: 978-1-5090-0638-0