A New Method to Induce Local Tensile Strain in SOI Wafers: First Strain Results of the “BOX Creep” Technique”

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Authors: A. Bonnevialle, C. Le Royer, Y. Morand, S. Reboh, J.-M. Pédini, A. Roule, D. Marseilhan, P. Besson, D. Rouchon, N. Bernier, C. Tabone, C. Plantier, M. Vinet,

Journal publisher: 2015 International Conference on Solid State Devices and Materials (SSDM)

Published year: 2015