Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

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Authors: S. Dempwolf, L. Hofmann, C. Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach

Journal publisher: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Published year: 2017

DOI identifier: 10.5281/zenodo.1043259