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Authors: B. Corbett, Z. Li, K. Buehler, F. Naumann, U. Krieger, S. Wicht, C. A. Bower
Journal title: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
Journal publisher: IEEE
Published year: 2019
Published pages: 34-34
DOI identifier: 10.23919/ltb-3d.2019.8735381
ISBN: 978-4-9047-4307-2
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