Electrothermal analysis of power multifinger HEMTs supported by advanced 3-D device simulation

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Authors: CHVÁLA, Aleš - MAREK, Juraj - PRÍBYTNÝ, Patrik - ŠATKA, Alexander - DONOVAL, Daniel - STOFFELS, Steve - POSTHUMA, Niels - DECOUTERE, Stefaan

Journal title: SISPAD 2017 - International conference on simulation of semiconductor processes and devices.

Journal publisher: IEEE

Published year: 2017

ISBN: 978-4-86348-612-6