Exposed die wafer level encapsulation by transfer molding

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Authors: S.H.M. Kersjes, J.L.J. Zijl, W.G.J. Gal, H.A.M. Fierkens, H. Wensink

Journal title: 2016 6th Electronic System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2016

Published pages: 1-4

DOI identifier: 10.1109/ESTC.2016.7764480

ISBN: 978-1-5090-1402-6