Thermal penetration depth investigations and BEOL metal impact on the thermal impedance in SiGe HBTs

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Authors: R. D’Esposito, S. Balanethiram, J.L. Battaglia, S. Frégonèse, T. Zimmer

Journal title: IEEE Electron Device Letters

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2017

ISSN: 0741-3106