Direct Bonding and Debonding Approach of Ultrathin Glass Substrates for High Temperature Devices

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Authors: Messaoud Bedjaoui, Sylvain Poulet

Journal title: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2017

Published pages: 725-732

DOI identifier: 10.1109/ectc.2017.79