Summary
This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.
Authors: Huang, Chih-Hsien; Hang, Gao; Torri, Guilherme Brondani; Mao, Shengping; Jeong, Yongbin; Cheyns, David; Rochus, Veronique; Rottenberg, Xavier
Journal title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal number: 15-18 April 2018
Journal publisher: IEEE
Published year: 2018
Published pages: 4
ISBN: 978-1-5386-2359-6
Search
Associated projects
Organisations
- Not specified