On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

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Authors: Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow

Journal title: Micromachines

Journal number: 11/6

Journal publisher: Multidisciplinary Digital Publishing Institute (MDPI)

Published year: 2020

Published pages: 564

DOI identifier: 10.3390/mi11060564

ISSN: 2072-666X