Innovative implementations of additive manufacturing for advanced microelectronics packaging

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Roshanghias, A., Dreissigacker, M.

Journal title: 2019 MiNaPAD (Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum)

Journal publisher: IEEE Electronics Packaging Society

Published year: 2019