Die Realisierung von Umverdrahtungslagen mittels Inkjet-Printing im Fan-Out Wafer Level Packaging

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Authors: Dreissigacker, M.; Roshanghias, A.; Becker K.-F.; Braun, T.;Schneider-Ramelow, M.; Lang, K.-D.

Journal title: Proceedings of MikroSystemTechnik Kongress 2019

Journal publisher: VDE/VDI-Ges. Mikroelektronik Mikrosystem- u. Feinwerktechnik

Published year: 2019