Summary
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Authors: C. Charpin-Nicolle, M. Bonvalot, R. Sommer, A. Persico, M.L. Cordeau, S. Belahcen, B. Eychenne, Ph. Blaise, S. Martinie, S. Bernasconi, E. Jalaguier, E. Nowak
Journal title: Microelectronic Engineering
Journal publisher: Elsevier BV
Published year: 2019
Published pages: 111194
DOI identifier: 10.1016/j.mee.2019.111194
ISSN: 0167-9317