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Authors: W. D. van Driel, J.G.J. Beijer, J.W. Bikker, C.H.M. van Blokland, C. Ankomah, B. Jacobs
Journal title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2018
Published pages: 1-6
DOI identifier: 10.1109/eurosime.2018.8369875
ISBN: 978-1-5386-2359-6
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