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Authors: B. Jacobs, W. D. van Driel, M. Schuld
Journal title: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2018
Published pages: 1-4
DOI identifier: 10.1109/eurosime.2018.8369895
ISBN: 978-1-5386-2359-6
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