TCAD investigation on hot-electron injection in new-generation technologies

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Authors: S. Reggiani, M. Rossetti, A. Gnudi, A.N. Tallarico, A. Molfese, S. Manzini, R. Depetro, G. Croce, E. Sangiorgi, C. Fiegna

Journal title: Microelectronics Reliability

Journal number: 88-90

Journal publisher: Elsevier BV

Published year: 2018

Published pages: 1090-1093

DOI identifier: 10.1016/j.microrel.2018.07.097

ISSN: 0026-2714