Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

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Authors: P. Pribitny, A. Chvala, J. Marek, D. Donoval

Journal title: 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

Journal publisher: IEEE

Published year: 2018

Published pages: 1-4

DOI identifier: 10.1109/ASDAM.2018.8544562

ISBN: 978-1-5386-7490-1