The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

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Authors: T. Bieniek, G. Janczyk

Journal title: TechConnect Briefs

Journal number: 4

Journal publisher: TechConnect Briefs

Published year: 2018

Published pages: 59 - 62

ISBN: 978-0-9988782-1-8