TCAD Simulation Mmethodology for 3-D Electro-Physical and Advanced Thermal Analysis of Power Modules

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: P. Pribytny, A. Chvala, J. Marek, D. Donoval

Journal title: Advances in Electronic and Photonic Technologies - ADEPT 2018

Journal publisher: Institute of Electronics and Photonics, FEI STU in Bratislava

Published year: 2018

Published pages: 164-167

ISBN: 978-80-554-1450-8