Analysis and optimization of power module supported by new TCAD simulation methodology for 3-D electro-physical and advanced thermal analysis

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Authors: P. Pribytny, A. Chvala, J. Marek and D. Donoval

Journal title: Advances in Electronic and Photonic Technologies - ADEPT 2020

Journal publisher: Faculty of Electrical Engineering and Information Technology, Slovak University of Technology, Bratislava

Published year: 2020