Advanced FD-SOI and Beyond Low Temperature SmartCut™ Enables High Density 3-D SoC Applications

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Authors: W. Schwarzenbach, B.-Y. Nguyen, L. Ecarnot, S. Loubriat, M. Detard, E. Cela, C. Bertrand-Giuliani, G. Chabanne, C. Maddalon, N. Daval, C. Maleville

Journal title: IEEE Journal of the Electron Devices Society

Journal number: 7

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2019

Published pages: 863-868

DOI identifier: 10.1109/jeds.2019.2916460

ISSN: 2168-6734