Beyond advanced FDSOI: Low Temp SmartCut for enabling High Density 3D SoC applications

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Authors: W. Schwarzenbach, B. -Y. Nguyen, L. Ecarnot, S. Loubriat, M. Detard, E. Cela, C. Bertrand-Giuliani, G. Chabanne, C. Maddalon, N. Daval, C. Girard, C. Maleville

Journal title: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

Journal number: annually

Journal publisher: IEEE

Published year: 2018

Published pages: 1-2

DOI identifier: 10.1109/s3s.2018.8640192

ISBN: 978-1-5386-7627-1