Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

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Authors: C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, H. Osman

Journal title: ECS Transactions

Journal number: 75/7

Journal publisher: Electrochemical Society, Inc.

Published year: 2016

Published pages: 43-46

DOI identifier: 10.1149/07507.0043ecst

ISSN: 1938-5862