Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

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Authors: C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, and H. Osman

Journal title: ECS Transastions 2016

Journal number: volume 75, issue 7

Journal publisher: ECS transactions

Published year: 2016

Published pages: 43-46