Public Summary Report
Project: HELoS
Updated at: 29-04-2024
Resources
5625 items found
Whitepaper for policymakers detailing the top five prioritization of the emerging medical domains, addressing per emergi...
Project: HELoS
Updated at: 29-04-2024
Design Methodologies and Co-Design Options for Novel 3D Technologies
Project: MICROPRINCE
Updated at: 29-04-2024
Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Project: MICROPRINCE
Updated at: 29-04-2024
Transfer-print integration of GaAs p-i-n photodiodes onto silicon nitride waveguides for near-infrared applications
Project: MICROPRINCE
Updated at: 29-04-2024
Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Project: MICROPRINCE
Updated at: 29-04-2024
A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems
Project: MICROPRINCE
Updated at: 29-04-2024
Transfer printing for heterogeneous silicon PICs
Project: MICROPRINCE
Updated at: 29-04-2024
MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level
Project: MICROPRINCE
Updated at: 29-04-2024
MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA
Project: MICROPRINCE
Updated at: 29-04-2024
Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing
Project: MICROPRINCE
Updated at: 29-04-2024
Micro-Transfer-Printing and Potential Process Optimizations by FEA
Project: MICROPRINCE
Updated at: 29-04-2024
Manufacturing Capability of Micro-Transfer Printing
Project: MICROPRINCE
Updated at: 29-04-2024
Micro-transfer-printing for heterogeneous integration
Project: MICROPRINCE
Updated at: 29-04-2024
MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly
Project: MICROPRINCE
Updated at: 29-04-2024
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing
Project: MICROPRINCE
Updated at: 29-04-2024
Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT
Project: MICROPRINCE
Updated at: 29-04-2024
METHOD FOR MANUFACTURING A CM OR DM INDUCTOR AND CM OR DM INDUCTOR
Project: UltimateGaN
Updated at: 29-04-2024
Study of semi-vertical GaN-on-Si FETs by DLTFS with optical excitation
Project: UltimateGaN
Updated at: 29-04-2024
Epitaxial growth of vertical GaN device layer stacks on 200 mm engineered substrates
Project: UltimateGaN
Updated at: 29-04-2024
Degradation of 600V GaN HEMTs under repetitive short circuit conditions.
Project: UltimateGaN
Updated at: 29-04-2024
DISLOCATION TYPE AND DENSITY DISCRIMINATION IN SEMICONDUCTOR MATERIALS USING CATHODOLUMINESCENCE MEASUREMENTS
Project: UltimateGaN
Updated at: 29-04-2024
METHOD OF MANUFACTURING A III-N ENHANCEMENT MODE HEMT DEVICE
Project: UltimateGaN
Updated at: 29-04-2024
A new approach for high resolution TEM analysis of electrically active defects in pGaN HEMT devices
Project: UltimateGaN
Updated at: 29-04-2024
Understanding the mechanism of Ga incorporation in InAlN and InGaN grown by MOCVD
Project: UltimateGaN
Updated at: 29-04-2024
Root cause analysis of gate shorts in semi-vertical GaN MOSFET devices
Project: UltimateGaN
Updated at: 29-04-2024
Recent advancements in vertical GaN Device Development on Engineered substrates
Project: UltimateGaN
Updated at: 29-04-2024
Challenges in Vertical GaN Device Development
Project: UltimateGaN
Updated at: 29-04-2024
Determination of Quasi-Coaxial Via Capacitance using Conformal Mapping Technique
Project: UltimateGaN
Updated at: 29-04-2024